Kopa Foil

Kopa foil em i wanpela liklik kopa strip we tik bilong en i save stap namel long 5-200 maikron. Bikos em i gat gutpela 'conductivity', 'thermal conductivity', na 'processability', planti manmeri i save yusim long ol dispela wok:

1. Elektroniks na Elektrikel Indastri

Wokim ol 'circuit board': Olsem 'conductive layer' bilong ol 'printed circuit boards' (PCBs), em i as bilong ol 'electronic devices'.

Lithium ion battery negative electrode current collector: ol i save yusim long ol lithium-ion bateri long helpim wok bilong sasim na rausim karent.

Electromagnetic shielding material: ol i wokim long shielding film long rot bilong kopa koting o roling proses, ol i yusim long stopim-interference bilong ol ilektronik divais.

2. Nupela eneji na eneji stoa

Fotovoltaik indastri: Olsem wanpela 'electrode material' bilong ol sola sel, em i save helpim 'photoelectric conversion efficiency'.

Ol 'supercapacitors': Ol i save yusim 'high purity copper foil' long ol 'electrode' bilong helpim wok bilong putim pawa.

3. Ol narapela fil

Dekoresen na Akiteksa: Ol i save wokim dekoretiv kopa foil long rot bilong 'etching' na ol i save yusim long wokim piksa o ol bilding.

Ol samting we i save karim hat: ol i save yusim olsem wanpela samting bilong rausim hat o ol samting bilong lukautim hat.

Bilong wanem yu makim mipela

Setifiket bilong mipela

ISO9001, ISO14001, ISO45001, IATF16949. UL, CMA, SGS.

Sales Maket

Mipela i save salim ol prodak bilong mipela i go long moa long 20 kantri long wol. Ol dispela kantri em Amerika, ol kantri long Yurop, na ol kantri long Saut-is Esia.

Sevis bilong mipela

Pastaim long salim: Laboratori Tes na Bulk Inspeksen.

Diskripsen

Ol samting	Electrolytic copper foil, Rolled copper foil , Battery copper foil, Plated copper foil.
Ol sais	Tiknes 0.007-0.15mm, Width 10-1200 mm.
Belhat	Annealed, 1/4H, 1/2H, 3/4H, Full hard, Spring.
Pinis	Nogat, Tin plet, Nikel plet.

Ol samting bilong bodi

Kopa foil em i liklik, isi long tanim tanim, na i save stap longpela taim. Sampela bikpela samting bilong bodi em:

Tiknes

Planti taim em i save stap namel long 9 i go inap 140 maikromita.

Mak bilong ol samting i pas pas wantim

Klostu 8.9 g/cm3.

Poin bilong melt:

1084.62 digri (1984.32 digri F).

Strong bilong holim

I save senis bihainim tiknes na pasin bilong wokim.

Ol samting bilong pawa

Ol samting bilong lektrik bilong kopa foil em i samting we i mekim em i gutpela tru long ol samting bilong elektronik:

Elektrikel kondaktiviti

5.96 × 10^7 S/m long 20 digri.

Resistiviti

1.68 × 10^-8 Ω·m long 20 digri.

Tempereja koefisen bilong resistens

0.003862 K^-1.

Ol samting bilong hat

Ol 'thermal characteristics' bilong 'copper foil' i helpim long yusim long 'heat management' aplikesen:

Kondaktiviti bilong hat

401 W/(m·K) long 25 digri.

Koefishen bilong 'thermal expansion'

16.5 × 10^-6 K^-1 long 20 digri.

Ol kemikel samting

Ol kemikel samting bilong kopa foil i save mekim na em i no inap stap longpela taim na yusim bilong en:

Korosen resistens:Em i gutpela, tasol em inap long bagarap sapos i gat salfa.

Oksidesen:Em i save kamapim wanpela 'protective layer' bilong 'copper oxide' taim em i stap long win.

Reaktiviti:Em i save wok wantaim ol asid na strongpela beis.

Bes long Surface Tritmen

Ol i save putim kain kain 'surface treatments' long 'copper foil' bilong mekim sampela wok:

Kopa foil we ol i no bin tritim.

Kopa foil we ol i bin tritim (bilong mekim 'adhesion' i pas gut).

Hai-temperature elongasen (HTE) tritim foil.

Low-profail kopa foil.

Reverse-treated copper foil.

Pakim na salim i go

Standet 'seaworthy export packaging'. Ol diwai palet wantaim plastik bilong lukautim koil na pepa. Ol sevis bilong 'packaging' i ken kamap bihainim ol narapela narapela 'regional temperature' bilong ol kastoma.

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FAQ

Q: Yu nidim hamas taim long redim ol samting bilong mi?

A: 3-5 de bilong ol samting bilong bateri. 5-25 de bilong ol ikwipmen (bihainim ol narapela narapela model na namba).

Q: Mipela i ken putim 'logo' o nem bilong kampani bilong mipela long ol prodak o paket?

A: Tru. yu ken prinim logo bilong yu long ol prodak bilong yu long rot bilong 'hot stamping', 'printing', 'embossing', 'uv coating', 'silk-screen printing' o 'sticker'. Long rot bilong lukluk gut long maket na givim gutpela sevis long ol kastoma bilong wol, mipela i singautim ol ovasis ejen long kamapim gutpela bihain taim wantaim.

Q: Hau bai mi inap long putim na operetim masin long mi yet?

A: Sistem R&D bilong mipela i stap long 'integrated development view'. taim yu kisim masin, yu mas konektim wantaim pawa bilong lektrik, na bihain masin i ken wok. bikos ol i bin putim ol Inglis sofwet insait long dispela masin. wanem samting yu mas mekim em long lainim tasol yusim bilong sofwet, na ful Inglis yusa manuel bai helpim yu wantaim masin.

Q: Hau long kisim teknikel sapot bihain long yu baim?

A: Faktori bilong mipela i save givim teknikel sapot long tok Inglis, yu ken isi long kisim mipela long intanet long Skype, Wechat, na Email, sapos yu nidim wanpela rimot asisten sapot, orait mipela bai sapotim yu long Team Viewer.

Q: Wanem waranti bilong ol samting?

A: Mipela i gat bikpela bilip long ol prodak bilong mipela, na mipela i save putim ol gut tru, olsem na planti taim yu bai kisim oda bilong yu i stap gut. Sapos yu gat hevi long sait bilong kwaliti, mipela bai stretim hariap. Woranti bilong ol ikwipmen em 1 o 2 yia (12 o 24 mun i dipen long kain prodak), Sapos ol hap bilong ikwipmen i bagarap bikos long ol samting we i no bilong man insait long wanpela yia, mipela bai givim ol narapela hap nating.

Mipela i gat nem olsem wanpela bilong ol bikpela kampani bilong wokim na saplaim ol kopa foil long Saina. Plis yu ken salim ol gutpela kopa foil long faktori bilong mipela. Long kisim sevis we i stret long yu, yu ken toktok wantaim mipela nau.